Printed Circuit Board Assembly & Test
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Originally the mainstay of our business, PCB (PC Board) assembly and test remains the core of the work we do. Our business supports a full range of capabilities, ranging from low-volume, high-mix assemblies to very high volume requirements.
PCB Capabilities:
- Multiple layer boards
- High density signal and power
- Mixed- technology boards, both SMD and thru-hole
- High density SMD
- Double sided component populated boards
- 0201 Passives
- QFP’s to 0.3mm
- CSP’s to 0.5m
- High density BGA
- Double sided mirrored BGA assembly
- PCMCIA
- High pin count interconnects
- Mictor Connectors
- Fine pitch high pin count press fit connectors
- Fine pitch interconnects
PCB Process Capabilities:
- Aqueous and no-clean
- Ionic contamination testing
- Multiple board finishes, HASL, Gold immersion
- Optical and High-resolution X-ray Inspection
